LED GOB and COB Technology development

Technology is a process of trial and error. The reason why GOB can‘t call it technology is because a team that wants to copy COB‘s technology hopes to find a shortcut to business behavior after encountering difficulties.

01

The origin of the GOB

Choose the time node for launch: when COB technology has been recognized by the industry after eight years of research and development.

2. OB group: COB, English Chip On Borad, literal translation: chip on board; Later there is GOB, Glue On Board, literal translation: glue on the board.

02

Whether GOB can be called packaging technology

As we all know, the three major packaging technologies of DIP, SMD and COB so far are all related to LED chip-level technology, and GOB does not involve the protection of LED chips, but on the SMD module, the bracket PIN pin of the SMD device is a protective process for glue protection. If you insist on calling it a technology, GOB LED screen can only be regarded as a module-level protection technology.